OSRAM automotive LED KW HJL531.TE 9w white SMD

Place of Origin:	Germany
Brand Name:	OSRAM
Model Number:	KW HJL531.TE
Certification:	AEC-Q102

Minimumpacking Quantity:	2000
Price:
Packaging Details:	Tape and Reel
Delivery Time:
Payment Terms:

OSLON® Black Flat S    KW HJL531.TE    OSLON Black Flat S is able to meet a wide range of requirements. The SMT device is very stable,durable and can beused with standard processes. A new solder pad layout allows for high reliability and improved thermal management. The compact chips not only deliver high light output, they are also individually addressable with an ensured chip-to-chip contrast which makes this LED an ideal solution for Adaptive Driving Beam (ADB).

Applications

- Static Forward Lighting

Features

- Package: SMD epoxy package

- Chip technology: UX:3

- Typ. Radiation: 120° (Lambertian emitter)

- Color: Cx = 0.322, Cy = 0.334 acc. to CIE 1931 (● ultra white)

- Corrosion Robustness Class: 3B

- Qualifications: AEC-Q102 Qualified with RV-level 1

- ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

Ordering Information

Maximum Ratings

* The median lifetime (L70/B50) for Tj = 175°C is 100h.

Characteristics

I F = 1000 mA; TS = 25 °C

Brightness Groups

Forward Voltage Groups

Chromaticity Coordinate Groups3)

Chromaticity Coordinate Groups3)

Group Name on Label

Example: T0-ebvF46-DF

Relative Spectral Emission 6)

Φrel = f (λ); IF = 1000 mA; TS = 25 °C

Radiation Characteristics 6)

I rel = f (ϕ); TS = 25 °C

Dimensional Drawing8)

Further Information:

Approximate Weight:                                                    35.0 mg

Corrosion test:                                                                Class: 3B

Test condition:                                                                40°C / 90 % RH / 15 ppm H2 S / 14 days (stricter than IEC

                                                                                          60068-2-43)

ESD advice:                                                                     The device is protected by ESD device which is connected                                                                                           in parallel to the Chip.

Electrical Internal Circuit

Recommended Solder Pad8)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the customer is responsible to evaluate the combination of PCB board and solder paste material for his application.

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Taping8)

Tape and Reel9)

Reel Dimensions

Barcode-Product-Label (BPL)

Dry Packing Process and Materials8)

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

Type DesignationSystem

Notes

The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources(e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related information please visithttps://ams-osram.com/support/application-notes

Disclaimer

Attention please!

The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version on our website.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.

Our products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.

Glossary

1)Brightness:Brightness values are measured during a current pulse of typically 25 ms, with an internal  reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

2)Reverse Operation:This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED.

3)Chromaticity coordinate groups:Chromaticity coordinates are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to GUM with a coverage factor of k = 3).

4)Forward Voltage:The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

5)Thermal Resistance:Rth max is based on statistic values (6σ) used for Derating.

6)Typical Values:Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.because of technical improvements, these typ. data will be changed without any further notice.

7)Characteristic curve:In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit.

8)Tolerance of Measure:Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

9)Tape and Reel:All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

Revision History